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    PCB流程三
    2014-12-24 11:33:44

     

    修飾成型后之板邊,使之平滑,減少板面間刮傷
    Edge grind to ensure smooth and reduce scratch between working panels.


    完成導通孔及非導通孔鉆孔作業。
    Finished drilling the "PTH"and "NPTH"on the single-side.


    利用磨刷及高壓水洗,去除鉆孔產生的披鋒以及粉屑。
    Clear away burrs and dust by brusher and water rinse.

    利用化學藥水軟化并最終去除因鉆針高速旋轉摩擦孔壁樹脂所產生的膠渣,確保內外層能正常導通。
    Remove the resin smear caused by high speed drilling in holes by chemical reaction to connect inner layer and outer layer.

    非金屬之孔壁沉積一層薄銅,使孔壁金屬化﹐使上下銅層與內層銅相連通提供導電性 Deposit a thin copper in hole wall to connect the up and down copper with inner copper for conductivity.

    利用電化學原因將銅離子還原成銅金屬,使板面及孔內得到我們所需要的鍍層厚度
    Revert cupric ion to copper metal by electric chemical,which is to get the copper thickness on surface and hole we required
    .


    清潔板面氧化物,烘干板面防止氧化。
    Clean away the oxidization on the board and dry the board surface to aviod oxidation.


    利用磨刷輪對板面進行處理以達到清潔及粗化板面之效果
    Clean and coarsen the surface of board by brush track.

    將用于外層線路影像轉移基礎的半固化干膜通過加熱加壓,使其緊密貼附于電鍍后的板面;
    Attach the dry film to the surface of board after plating in high temperature.

    利用紫外線(UV)的能量﹐透過底片照射在板面的感光膜上﹐使感光膜中的光敏物質發生光化學反應﹐完成影像轉移的目的
    The PCB with dry film expose in UV light which penetrates through films to transfer image from film to PCB  by photopolymerization.

    分別用顯影液及蝕刻液去除非線路、未感光的干膜及銅層,留下有感光干膜保護的線路,最后去除線路上的干膜,使外層線路顯現;.Remove extra dry film and the copper and keep the pattern protected by dry film stay. Then show the pattern of outer layer by stripping dry film.photosensitive corrosion resistant layer by solution to pattern in outer layer.

          

     

     
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